Application Overview

The properties of IC packaging can be greatly affected by the presence of water. The plastic encapsulation used to package integrated circuits in the last stage of manufacture can be significantly damaged by a humid environment. Plastic is hydrophilic in nature and therefore adsorbs moisture that can lead to degradation. The presence of water can also lead to problems during soldering processes, including cracking and “popcorning”.

Due to the importance of this issue, there are standards (IEC 60749 and IPC/JEDEC J-STD-020C) that have been developed to cover the testing of moisture sorption by electronic components and the IGAsorp-CT was developed specifically to perform the measurements described by these standards.

Product Information Pages

IGAsorp-CT

Application Notes

Article 114    Climatic Testing of Electrical Components 

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